Announcement and Call for papers

ISSE 2004

27^th International Spring Seminar on Electronics Technology

13-16, May, 2004, Sofia, Bulgaria

SPONSORED by:

IEEE Joint Chapter of Bulgaria – ED/MTT/CPMT

CPMT Chapters from Central Europe

May 13-16, 2004, Sofia, Bulgaria

http://www.tu-sofia.bg/isse/isse04.htm

Meeting the Challenges of Electronics Technology Progress

Chairman of ISSE 2004

Prof Dr.Sc. Ph. Philippov TU Sofia

INTERNATIONAL STEERING COMMITTEE

• Prof. Reinhard Bauer, University of Applied Sciences Dresden Germany
• Prof. Rudolf Becker - Honorary Member, University of Applied Sciences Dresden Germany
• Prof. Michael Caggiano, Rutgers University Piscataway, NJ, USA
• Prof. Zdzislaw Drozd, TU Warsaw, Poland
• Prof. Peter J. Gielisse, Florida State University, Tallahassee, Fl, USA 
• Prof. Leszek Golonka, TU Wroclaw, Poland
• Dr. Marko Hrovat, Jozef Stefan Institute, Ljubljana, Slovenia
• Prof. Benedyt Licznerski, Honorary Member, TU Wroclaw, Poland
• Dr. Zsolt Illyefalvi-Vitéz, BME, Budapest, Hungary
• Dr. Pavel Mach, CTU Prague, Czech Republic
• Prof. James E. Morris, Portland State University, USA
• Prof. Nencho Nenov, Higher School of Transport, Sofia, Bulgaria
• Dr. Johann Nicolics, Vienna UT, Austria
• Dr. Tamara Pencheva, Ruse University, Bulgaria
• Prof. Philipp Philippov, TU Sofia, Bulgaria
• Assoc. Prof. Alena Pietriková, Technical University of Košice, Slovakia
• Prof Dan Pitica, TU Cluj-Napoca, Romania
• Prof. Wilfried Sauer, TU Dresden, Germany
• Prof. Paul Svasta, Politehnica University of Bucharest, Romania
• Prof. Boris Tsyganok, NTU Kiew; Ukraine
• Prof. Klaus-Jürgen Wolter, TU Dresden, Germany Chairman of ISSE

NATIONAL ORGANIZERS

V. Sgurev Federation of Science Technical Unions in Sofia 

N. Nenov Higher School of Transport, Sofia

Ph. Philippov TU Sofia

T. Pencheva Ruse University

Chair: K. Asparuhova - Technical University of Sofia

INVITATION

It is our pleasure to invite you to participate in IEEE ISSE 2004. The previous Conference ISSE 2003 drew 25 oral and 78 poster presentations from 18 nations. The National Organizing Committee decided to organize the conference in Sofia. The Bulgarian capital combines modern infrastructure, beautiful natural and architectural sights and many possibilities for a creative work. The conference timetable is concerned with several other congresses and international conferences in similar scopes i.e. MIEL conference (15-19 May 2004). Because the distance between Sofia and Nish (Niš) is 155km Sofia-airport is appropriate to be used for both events. There will be a bus connection available to the MEIL conference place Nish, Serbia and Montenegro on demand.

Primary objective of the Seminar is to provide an international forum for dissemination of information and scientific results of young scientists relating to education, research and development activities at universities. Concurrent Engineering, as a structural process, allows a properly staffed team to create an optimum product design and represents a challenge to networking. It is a tradition for all participants of the Seminar to present paper(s) which are published in the Proceedings.

A further aspect of the program is its focus on the field of electronics packaging within the broader scope of microelectronics technology. All the principal investigators are active in electronics packaging research and education, which provides the point of contact for the group.

Electronics packaging is the multidisciplinary field that in principle covers all aspects of electronics systems integration starting from the bare silicon die. On a more practical "first" level, it covers the electrical, mechanical, and thermal design of the single or multi-chip package that supports and protects the chip, and provides electrical interconnection to other such packages. At the "second" level, it includes the multi-disciplinary design of the boards and systems on which such chips or first-level packages are assembled.

The conference scene encompasses the fields of the following IEEE societies: CPMT, Electron Devices, MTT and Circuits and Systems. The focus is put on the topics listed below.

We offer for you three challenging days with ISSE 2004 full of comfort and unforgettable impressions!

TOPICS OF INTEREST

• HDL electronic system design in informatics and control systems, modelling and simulation, chaos theory.
• Electromagnetic compatibility and signal integrity analysis; electrostatic discharge
• New PCB-production technologies and materials in electronic and opto-electronic modules manufacturing (SMT/PCB/ MCM).
• Thermal management, reliability and life time-prediction in electronics.
• Thin- and thick film techniques in electronics
• Reliability concepts of interconnection technology and general electronics technology and modern methods of Quality management
• Electronic components and Innovative packaging concepts (SMD, µBGA, CSP)
• Nano-technologies:
• Nano-coating materials
• Nano-electronics
• High K-gate dielectric for flash memories
• Optical inspection in circuit-test systems, non destructive tests
• Design and application of sensor in microsystems
• Modern education in Electronics
• Automation of research experiments
• Applications areas of electronic technologies in:
• System investigation and process control, PV equipment 
• Design and application of sensor in Microsystems
• Automotive
• Transport
• Data processing and electronic media control
• Robotics

• Telecommunications

COPYRIGHT CONDITIONS

The material submitted for the presentation at IEEE meeting must be original. All papers accepted for presentation will appear in the Proceedings on the base of the “Annual School. Lectures”, distributed by: http://www.tib.uni-hannover.de/kataloge/ (signature ZY804), and will be distributed to the participants together with CD-ROM and information about their impact factor of the papers.

IEEE holds copyright of the material presented at the meeting. Authors will be informed about the WEB address where they shall find the IEEE copyright transfer form.

This copyright transfer form will be distributed together with some other document after accepting information of the papers!

CALL FOR PAPERS

Interested authors are requested to submit to the Conference Chairman the electronic version of their abstracts, in English, via E-mail before 10^th of February 2004. The first page must contain the paper title, authors’ name(s) and the complete addresses of the corresponding author (E-mail, Phone and/or FAX). The abstract (200-250 words) completed with 2 to 5 keywords characterizing the paper. The updated information for the authors should be obtained from the conference WEB site: http://www.tu-sofia.bg/isse/isse04.htm

Correspondence e-mail: isse-office@tu-sofia.bg

Submission of papers e-mail: isse-print@tu-sofia.bg

Address: Technical University of Sofia, 8, Kliment Ohridski bul. Sofia – 1000, Bulgaria.

Phone: (+359 2) 684124.

All papers must be in MSWord format (*.doc, Version 97 or later) with marked place of the figures and graphics. The figures have to be in the authors' original format. See web site for more information.

DEADLINES

Expression of interest: 12^th of January 2004.

Invited session and Speakers Before the 31^th of January 2004

Proposal:

Submission of abstracts: By the 10^th of February 2004. E-mailing the electronic version

Notification of acceptance: By the 25^th of February 2004 (via E-mail)

Submission of final papers: To be received on 31^th March 2004 at the latest

Registration of authors: With the submission of camera-ready papers

 FEES

 To be determined by IEEE and the local organizer. There will be special reduced rate for students and post-graduated student members of IEEE and members of IEEE.

LOCATION

The Conference places in Sofia and its surrounds. The City is only 15km far from the international airport, and is connected to it by a highway with a regular bus transport. There are available different car service facilities. If necessary, please write us and we can help you about the organization of the local transport and the transportation to Nish and back to Sofia-airport and/or about planning your personal schedule for Conference activities. Details will be available at the conference web site.